One of the product lines we most frequently request includes custom glass covers for various advanced applications. These include encapsulation covers with precisely cut center cavities and stepped edges for bonding and sealing, as well as protective glass Windows, transparent covers for microfluidic devices, and substrates for bonding or optical alignment. Whether used to protect organic semiconductor devices, support MEMS structures, or seal thin-film sensors, our components can operate reliably in harsh environments.
★CNC milling of circular or rectangular openings with tight tolerance control
★Edge step machining for adhesive bonding or pressure sealing
★Ultra-smooth surfaces polished down to Ra < 5 Å for optical transparency
★Dimensional consistency within ±0.01 mm, even for small batches
These features make our glass substrates ideal for research packaging applications where both mechanical fit and surface quality directly affect device integrity and test validity.
Tailored Glass Solutions for Research-Driven Applications
We work extensively with scientific labs, university departments, and R&D teams on projects involving organic semiconductor packaging, OLED displays, and next-generation sensors. Our products have been applied in:
★Organic photovoltaic encapsulation
★Flexible transistor packaging
★Wafer-level MEMS protection
★Glass covers for photonic experiments
★Microfluidic chip sealing
| Parameter | Capability |
|---|
| Minimum Thickness | 0.10 mm |
| Maximum Size | 600 mm × 600 mm |
| Central Cutout Tolerance | ±0.02 mm |
| Step Depth / Edge Feature | ±0.01 mm accuracy |
| Surface Roughness (Ra) | Down to 5 Å (0.5 nm) |
| Cleanroom Compatibility | Class 1000 (ISO 5) ultrasonic cleaning and vacuum packaging |
Our engineers are fluent in research language and experimental needs. Whether your design is in CAD, a hand-drawn sketch, or simply a functional requirement, we will help translate it into a manufacturable glass part — fast and reliably.
Precision CNC Glass Machining for Scientific Use
Our advanced CNC machining capabilities allow us to deliver custom geometries for even the most complex device housing structures. We can achieve:
These capabilities make us a preferred partner for optical wafer polishing, glass cover micro-machining, and encapsulation glass manufacturing for scientific and experimental applications.
Why Researchers Worldwide Trust Us
Our company is not just a glass factory — we are a solution partner to researchers. We understand:
Professional
The need for rapid response and technical consultation
Understand glass materials
The importance of material selection for optical clarity, chemical resistance, and temperature stability
low MOQ
The typical constraints of low-volume, high-spec academic orders
Extremely small tolerance
The demands of working with complex sealing geometries, including flatness and parallelism glass tolerances
We have successfully delivered custom cover plate solutions to institutions in Germany, France, the U.S., Korea, and beyond. Our client list includes government-funded labs, semiconductor research hubs, and interdisciplinary engineering teams.
Custom Glass for Organic Semiconductor Packaging
The packaging of organic semiconductor devices requires precise, inert and stable materials that do not interfere with optical or electrical properties. We can offer you:
★Inert encapsulation without outgassing
★Highly customizable edge profiles for gluing, pressure fitting, or thermal bonding
★Cutout windows to prevent interference with active layers
★Coating compatibility for AR or hydrophobic finishes if required
★These attributes make our glass plates ideal for research into organic field-effect transistors (OFETs), organic light-emitting ★diodes (OLEDs), thin-film encapsulation, and more.
Start with a Drawing, End with a Solution
Whether you’re preparing your first experimental run or optimizing a critical long-term test, we help research groups move quickly from idea to hardware. Our technical sales engineers work closely with your team to:
★Review drawings or sketches
★Offer suggestions on material, tolerance, and finish
★Provide quick quotations (within 24–48 hours)
★Ensure repeatable results for scale-up and publication
★There is no minimum order quantity, and we accommodate multiple design iterations without delay.
Glass Surface Finishing and Polishing Services
In addition to geometric processing, we offer precision glass lapping and polishing services to meet ultra-flat, bonding-grade specifications. For applications requiring optical wafer polishing, cleanroom-grade surface prep, or flatness and parallelism glass matching across multi-layer stacks, we offer:
★Double-sided polishing for uniformity
★Thickness tolerance to ±0.005 mm
★Flatness up to λ/10 for laser alignment or bonding
★Edge chamfering and protective packaging
★Our glass surface finishing processes enhance sealing reliability, reduce particle contamination, and provide the precision ★needed in device-level research.
Glass Substrates Engineered for Innovation
Whether you are developing a chip-scale OLED, a sealed microfluidic sensor, or a multi-layer hybrid stack, we can build the glass interface you need — accurately, quickly, and with full transparency in both communication and material.
Request a Quote Today
If you’re looking for a custom glass cover plate with a center cutout and adhesive step, or any kind of research-grade encapsulation glass, contact us today. You can upload your drawing, sketch, or reference photo — and we will reply with a detailed quote and timeline.
We serve clients worldwide with fast shipping, technical responsiveness, and the precision only a specialist can offer.
Let’s bring your experiment to life — with glass that fits.